Global Next Generation Memory Market Synopsis
The Global Next Generation Memory Market was worth USD 7.73 Billion in 2023. As such, the forecast is that the market is expected to reach USD 62.63 Billion by 2032 with a CAGR of 26.17 % from 2024 to 2032.
Next Generation Memory refers to advanced memory technologies that surpass the capabilities of traditional memory types such as DRAM (Dynamic Random-Access Memory) and NAND (Not-And) flash memory. These technologies are designed to offer improvements in speed, endurance, and power efficiency, addressing the limitations of existing memory solutions and meeting the growing demands of modern computing and data processing applications.
- Next Generation Memory (NGM) Market is a rapidly evolving segment within the memory storage industry, driven by advancements in technology and increasing data requirements. NGM encompasses various emerging memory technologies that offer improvements over traditional memory types such as DRAM and NAND flash. These new technologies aim to enhance speed, efficiency, and storage capacity, catering to the growing needs of data-intensive applications and systems.
- Key Trends shaping the NGM market include the increasing adoption of AI and machine learning applications, which demand higher performance and faster data processing capabilities. Additionally, the rise of 5G technology and the Internet of Things (IoT) is creating a need for more advanced and efficient memory solutions. These trends are pushing the development of memory technologies that can handle larger volumes of data and provide quicker access.
- Market Growth is driven by the need for faster, more efficient, and higher-capacity memory solutions. The proliferation of smart devices, big data analytics, and cloud computing is significantly increasing the demand for advanced memory technologies. This growth is further supported by ongoing investments in research and development aimed at overcoming the limitations of current memory technologies.
- Challenges faced by the NGM market include high development costs and technological complexities associated with emerging memory solutions. Additionally, there are concerns regarding the integration of new memory technologies with existing systems and the need for standardization across different platforms. Addressing these challenges is crucial for the widespread adoption of next-generation memory technologies.
- Competitive Landscape is characterized by a high level of innovation and competition among key players. Companies are continuously striving to improve their memory solutions, enhance performance, and reduce costs. The market is witnessing significant investments in R&D and strategic partnerships to drive technological advancements and maintain a competitive edge.
Top Key Players Involved Are:
"Intel (USA), Micron Technology (USA), Samsung Electronics (South Korea), SK Hynix (South Korea), Toshiba (Japan), Western Digital (USA), IBM (USA), Qualcomm (USA), Cypress Semiconductor (USA), SanDisk (USA), Broadcom (USA), STMicroelectronics (Switzerland), Texas Instruments (USA), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Elpida Memory (Japan), Analog Devices (USA), HPE (USA), Renesas Electronics (Japan), Marvell Technology Group (USA), Advanced Micro Devices (AMD) (USA), ASML (Netherlands), ON Semiconductor (USA), Analog Devices (USA), GlobalFoundries (USA), Rambus (USA), ZTE Corporation (China), SanDisk (USA), and Xilinx (USA) and Other Active Players"
Global Next-Generation Memory Market Trend Analysis
Increasing Demand for High-Performance Computing
- The increasing demand for high-performance computing (HPC) is a significant driver of the NGM market. As applications and systems become more data-intensive, traditional memory technologies are struggling to keep up with the performance requirements. HPC applications, including artificial intelligence, machine learning, and big data analytics, require memory solutions that can handle large volumes of data at high speeds.
- With the growth of HPC applications, there is a pressing need for memory technologies that offer faster data processing and higher bandwidth. Next Next-generation memory technologies, such as 3D XPoint and MRAM (Magnetoresistive Random-Access Memory), are designed to meet these needs by providing improved performance and efficiency compared to conventional memory types.
- HPC environments often involve complex computations and large datasets, which necessitate memory solutions that can provide quick access to data and support parallel processing. Next Next-generation memory technologies are well-suited for these tasks due to their superior speed and endurance characteristics, making them a valuable asset in HPC systems.
- Companies focusing on HPC are investing heavily in NGM technologies to enhance their offerings and maintain a competitive edge. For instance, Intel (USA) and Micron Technology (USA) are leading the charge in developing high-performance memory solutions that cater to the evolving needs of HPC applications.
Advancements in Autonomous Vehicles
- Advancements in autonomous vehicles represent a significant opportunity for the Next Generation Memory market. As the automotive industry moves towards self-driving and advanced driver-assistance systems (ADAS), there is a growing need for memory technologies that can support the complex processing requirements of these systems.
- Autonomous vehicles rely heavily on real-time data processing to make immediate decisions based on inputs from various sensors, cameras, and radar systems. Next Generation Memory technologies, with their high-speed performance and low latency, are essential for handling the large volumes of data generated by these sensors and ensuring timely responses.
- The integration of NGM in autonomous vehicles can enhance the performance and reliability of these systems. For instance, memory technologies like MRAM (Magnetoresistive Random-Access Memory) and 3D XPoint can provide the speed and durability required for mission-critical applications in self-driving cars, such as real-time navigation, collision avoidance, and path planning.
- Automakers and technology companies are investing in research and development to incorporate advanced memory solutions into their autonomous vehicle platforms. Companies like NVIDIA (USA) and Intel (USA) are leading the way in developing and integrating high-performance memory technologies into their automotive solutions, aiming to improve the overall safety and efficiency of autonomous driving systems.
- Headquarters of key companies involved in this opportunity include NVIDIA (USA) and Intel (USA), both of which are at the forefront of integrating Next Generation Memory into automotive technologies to support the advancement of autonomous vehicles.
Global Next-Generation Memory Market Segment Analysis:
The Global Next Generation Memory Market is Segmented into Technology, Wafer Size, Application, and Region.
By Technology, the Non-Volatile segment is expected to dominate the market during the forecast period.
- The non-volatile segment of the Next Generation Memory Market has captured the largest share of global revenue due to its unique attributes and growing demand across various applications. Non-volatile memory, unlike volatile memory, retains data even when power is off, making it indispensable for devices where data persistence is crucial. This characteristic is highly valued in consumer electronics, automotive systems, and industrial applications where data integrity and reliability are essential.
- In recent years, advancements in non-volatile memory technologies, such as NAND flash, and NOR flash, and emerging technologies like ReRAM and FeRAM, have driven significant market growth. These technologies offer improved performance, higher storage density, and reduced power consumption, which contribute to their dominance in the market. As a result, non-volatile memory is increasingly used in smartphones, tablets, SSDs, and other high-performance computing devices.
- The demand for non-volatile memory is also fueled by the rapid growth of data-intensive applications, including big data analytics, cloud computing, and artificial intelligence. These applications require robust memory solutions that can handle large volumes of data and provide quick access, further boosting the market share of non-volatile memory. Its ability to deliver high-speed data access and reliable storage aligns well with the needs of modern computing environments.
- Moreover, the increasing adoption of non-volatile memory in emerging technologies, such as IoT devices and autonomous vehicles, reinforces its market position. As these sectors expand, the need for memory solutions that offer durability, fast access times, and low power consumption becomes more pronounced. Consequently, the non-volatile segment continues to lead in market revenue, driven by its technological advancements and widespread application across various industries.
By Application, the BFSI segment held the largest share in 2023.
- The Banking, Financial Services, and Insurance (BFSI) sector dominates the global Next Generation Memory market due to its high demand for advanced data processing and storage solutions. BFSI institutions generate and manage vast amounts of data daily, including transactions, customer information, and financial records. This data-intensive nature requires memory technologies that can handle large volumes of information quickly and reliably, leading to a strong preference for next-generation memory solutions.
- Next-generation memory technologies, such as Non-Volatile Memory Express (NVMe) and 3D NAND, offer significant improvements in speed, efficiency, and durability compared to traditional memory types. These advancements are crucial for BFSI organizations that rely on real-time data processing for transaction verification, risk management, and regulatory compliance. The ability to swiftly process and access large datasets enhances operational efficiency and decision-making, which is critical in the fast-paced financial industry.
- Additionally, the BFSI sector's growing focus on digital transformation and fintech innovation drives the adoption of next-generation memory solutions. As banks and financial institutions integrate more sophisticated technologies, such as artificial intelligence (AI) and blockchain, the need for high-performance memory systems becomes even more pronounced. These technologies require memory that can support complex computations and rapid data retrieval, further boosting the demand for advanced memory solutions.
- Finally, the BFSI sector's substantial investments in cybersecurity also contribute to the market's growth. Next-generation memory technologies are designed with enhanced security features to protect sensitive financial data from cyber threats. This focus on secure data management aligns with the BFSI sector's stringent regulatory requirements and its commitment to safeguarding customer information, reinforcing the sector's dominance in the global next-generation memory market.
Global Next Generation Memory Market Regional Insights:
Asia Pacific is Expected to Dominate the Market Over the Forecast Period
- The Asia-Pacific (APAC) region is currently dominating the Next Generation Memory Market, driven by its rapid technological advancements and substantial investments in-memory technology. Countries like China, Japan, and South Korea are major players in this sector, leveraging their robust semiconductor manufacturing capabilities. The APAC region's dominance is largely due to its high concentration of leading memory manufacturers, such as Samsung Electronics and SK Hynix, which are at the forefront of developing advanced memory solutions.
- In particular, South Korea and China have emerged as significant contributors to the market growth. South Korea's Samsung and SK Hynix are globally recognized for their innovations in DRAM and NAND flash technologies. Similarly, China's investments in semiconductor R&D and manufacturing facilities are enhancing its position in the global market. These nations are pushing the boundaries of memory technology, contributing to the APAC region's leadership.
- The region's dominance is also supported by the increasing demand for high-performance computing, mobile devices, and consumer electronics. The rapid adoption of advanced technologies such as artificial intelligence, big data analytics, and cloud computing is driving the need for faster and more efficient memory solutions. As these technologies proliferate, the APAC region continues to experience heightened demand for next-generation memory products.
- Furthermore, favorable government policies and initiatives in APAC countries bolster market growth. Governments are implementing strategies to support semiconductor research, development, and manufacturing, which in turn fosters innovation in next-generation memory technologies. These policies create an environment conducive to technological advancements, reinforcing the APAC region's leading position in the global next-generation memory market.
Global Next Generation Memory Market Top Key Players:
- Intel (USA)
- Micron Technology (USA)
- Samsung Electronics (South Korea)
- SK Hynix (South Korea)
- Toshiba (Japan)
- Western Digital (USA)
- IBM (USA)
- Qualcomm (USA)
- Cypress Semiconductor (USA)
- SanDisk (USA)
- Broadcom (USA)
- STMicroelectronics (Switzerland)
- Texas Instruments (USA)
- Infineon Technologies (Germany)
- NXP Semiconductors (Netherlands)
- Elpida Memory (Japan)
- Analog Devices (USA)
- HPE (USA)
- Renesas Electronics (Japan)
- Marvell Technology Group (USA)
- Advanced Micro Devices (AMD) (USA)
- ASML (Netherlands)
- ON Semiconductor (USA)
- GlobalFoundries (USA)
- Rambus (USA)
- ZTE Corporation (China)
- Xilinx (USA) and Other Active Players
Global Next Generation Memory Market
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Base Year:
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2023
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Forecast Period:
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2024- 2032
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Historical Data:
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2017 to 2023
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Market Size in 2023:
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USD 7.73 Bn.
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Forecast Period 2024-32 CAGR:
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26.17 %
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Market Size in 2032:
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USD 62.63 Bn.
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Segments Covered:
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By Technology
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- Non-Volatile Memory
- Volatile Memory
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By Wafer Size
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By Packaging
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- BFSI
- Consumer Electronics
- Government
- Telecommunications
- Information Technology
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By Region
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- North America (U.S., Canada, Mexico)
- Eastern Europe (Bulgaria, The Czech Republic, Hungary, Poland, Romania, Rest of Eastern Europe)
- Western Europe (Germany, UK, France, Netherlands, Italy, Russia, Spain, Rest of Western Europe)
- Asia Pacific (China, India, Japan, South Korea, Malaysia, Thailand, Vietnam, The Philippines, Australia, New-Zealand, Rest of APAC)
- Middle East & Africa (Turkey, Bahrain, Kuwait, Saudi Arabia, Qatar, UAE, Israel, South Africa)
- South America (Brazil, Argentina, Rest of SA)
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Chapter 1: Introduction
1.1 Scope and Coverage
Chapter 2:Executive Summary
Chapter 3: Market Landscape
3.1 Market Dynamics
3.1.1 Drivers
3.1.2 Restraints
3.1.3 Opportunities
3.1.4 Challenges
3.2 Market Trend Analysis
3.3 PESTLE Analysis
3.4 Porter's Five Forces Analysis
3.5 Industry Value Chain Analysis
3.6 Ecosystem
3.7 Regulatory Landscape
3.8 Price Trend Analysis
3.9 Patent Analysis
3.10 Technology Evolution
3.11 Investment Pockets
3.12 Import-Export Analysis
Chapter 4: Next Generation Memory Market by Technology
4.1 Next Generation Memory Market Snapshot and Growth Engine
4.2 Next Generation Memory Market Overview
4.3 Non-Volatile Memory
4.3.1 Introduction and Market Overview
4.3.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
4.3.3 Key Market Trends, Growth Factors and Opportunities
4.3.4 Non-Volatile Memory: Geographic Segmentation Analysis
4.4 Volatile Memory
4.4.1 Introduction and Market Overview
4.4.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
4.4.3 Key Market Trends, Growth Factors and Opportunities
4.4.4 Volatile Memory: Geographic Segmentation Analysis
Chapter 5: Next Generation Memory Market by Wafer Size
5.1 Next Generation Memory Market Snapshot and Growth Engine
5.2 Next Generation Memory Market Overview
5.3 200 mm
5.3.1 Introduction and Market Overview
5.3.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
5.3.3 Key Market Trends, Growth Factors and Opportunities
5.3.4 200 mm : Geographic Segmentation Analysis
5.4 300 mm
5.4.1 Introduction and Market Overview
5.4.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
5.4.3 Key Market Trends, Growth Factors and Opportunities
5.4.4 300 mm: Geographic Segmentation Analysis
Chapter 6: Next Generation Memory Market by Application
6.1 Next Generation Memory Market Snapshot and Growth Engine
6.2 Next Generation Memory Market Overview
6.3 BFSI
6.3.1 Introduction and Market Overview
6.3.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
6.3.3 Key Market Trends, Growth Factors and Opportunities
6.3.4 BFSI: Geographic Segmentation Analysis
6.4 Consumer Electronics
6.4.1 Introduction and Market Overview
6.4.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
6.4.3 Key Market Trends, Growth Factors and Opportunities
6.4.4 Consumer Electronics: Geographic Segmentation Analysis
6.5 Government
6.5.1 Introduction and Market Overview
6.5.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
6.5.3 Key Market Trends, Growth Factors and Opportunities
6.5.4 Government: Geographic Segmentation Analysis
6.6 Telecommunications
6.6.1 Introduction and Market Overview
6.6.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
6.6.3 Key Market Trends, Growth Factors and Opportunities
6.6.4 Telecommunications: Geographic Segmentation Analysis
6.7 Information Technology
6.7.1 Introduction and Market Overview
6.7.2 Historic and Forecasted Market Size in Value USD and Volume Units (2017-2032F)
6.7.3 Key Market Trends, Growth Factors and Opportunities
6.7.4 Information Technology: Geographic Segmentation Analysis
Chapter 7: Company Profiles and Competitive Analysis
7.1 Competitive Landscape
7.1.1 Competitive Benchmarking
7.1.2 Next Generation Memory Market Share by Manufacturer (2023)
7.1.3 Industry BCG Matrix
7.1.4 Heat Map Analysis
7.1.5 Mergers and Acquisitions
7.2 INTEL (USA)
7.2.1 Company Overview
7.2.2 Key Executives
7.2.3 Company Snapshot
7.2.4 Role of the Company in the Market
7.2.5 Sustainability and Social Responsibility
7.2.6 Operating Business Segments
7.2.7 Product Portfolio
7.2.8 Business Performance
7.2.9 Key Strategic Moves and Recent Developments
7.2.10 SWOT Analysis
7.3 MICRON TECHNOLOGY (USA)
7.4 SAMSUNG ELECTRONICS (SOUTH KOREA)
7.5 SK HYNIX (SOUTH KOREA)
7.6 TOSHIBA (JAPAN)
7.7 WESTERN DIGITAL (USA)
7.8 IBM (USA)
7.9 QUALCOMM (USA)
7.10 CYPRESS SEMICONDUCTOR (USA)
7.11 SANDISK (USA)
7.12 BROADCOM (USA)
7.13 STMICROELECTRONICS (SWITZERLAND)
7.14 TEXAS INSTRUMENTS (USA)
7.15 INFINEON TECHNOLOGIES (GERMANY)
7.16 NXP SEMICONDUCTORS (NETHERLANDS)
7.17 ELPIDA MEMORY (JAPAN)
7.18 ANALOG DEVICES (USA)
7.19 HPE (USA)
7.20 RENESAS ELECTRONICS (JAPAN)
7.21 MARVELL TECHNOLOGY GROUP (USA)
7.22 ADVANCED MICRO DEVICES (AMD) (USA)
7.23 ASML (NETHERLANDS)
7.24 ON SEMICONDUCTOR (USA)
7.25 ANALOG DEVICES (USA)
7.26 GLOBALFOUNDRIES (USA)
7.27 RAMBUS (USA)
7.28 ZTE CORPORATION (CHINA)
7.29 SANDISK (USA)
7.30 AND XILINX (USA)
7.31 OTHER ACTIVE PLAYERS
Chapter 8: Global Next Generation Memory Market By Region
8.1 Overview
8.2. North America Next Generation Memory Market
8.2.1 Key Market Trends, Growth Factors and Opportunities
8.2.2 Top Key Companies
8.2.3 Historic and Forecasted Market Size by Segments
8.2.4 Historic and Forecasted Market Size By Technology
8.2.4.1 Non-Volatile Memory
8.2.4.2 Volatile Memory
8.2.5 Historic and Forecasted Market Size By Wafer Size
8.2.5.1 200 mm
8.2.5.2 300 mm
8.2.6 Historic and Forecasted Market Size By Application
8.2.6.1 BFSI
8.2.6.2 Consumer Electronics
8.2.6.3 Government
8.2.6.4 Telecommunications
8.2.6.5 Information Technology
8.2.7 Historic and Forecast Market Size by Country
8.2.7.1 US
8.2.7.2 Canada
8.2.7.3 Mexico
8.3. Eastern Europe Next Generation Memory Market
8.3.1 Key Market Trends, Growth Factors and Opportunities
8.3.2 Top Key Companies
8.3.3 Historic and Forecasted Market Size by Segments
8.3.4 Historic and Forecasted Market Size By Technology
8.3.4.1 Non-Volatile Memory
8.3.4.2 Volatile Memory
8.3.5 Historic and Forecasted Market Size By Wafer Size
8.3.5.1 200 mm
8.3.5.2 300 mm
8.3.6 Historic and Forecasted Market Size By Application
8.3.6.1 BFSI
8.3.6.2 Consumer Electronics
8.3.6.3 Government
8.3.6.4 Telecommunications
8.3.6.5 Information Technology
8.3.7 Historic and Forecast Market Size by Country
8.3.7.1 Bulgaria
8.3.7.2 The Czech Republic
8.3.7.3 Hungary
8.3.7.4 Poland
8.3.7.5 Romania
8.3.7.6 Rest of Eastern Europe
8.4. Western Europe Next Generation Memory Market
8.4.1 Key Market Trends, Growth Factors and Opportunities
8.4.2 Top Key Companies
8.4.3 Historic and Forecasted Market Size by Segments
8.4.4 Historic and Forecasted Market Size By Technology
8.4.4.1 Non-Volatile Memory
8.4.4.2 Volatile Memory
8.4.5 Historic and Forecasted Market Size By Wafer Size
8.4.5.1 200 mm
8.4.5.2 300 mm
8.4.6 Historic and Forecasted Market Size By Application
8.4.6.1 BFSI
8.4.6.2 Consumer Electronics
8.4.6.3 Government
8.4.6.4 Telecommunications
8.4.6.5 Information Technology
8.4.7 Historic and Forecast Market Size by Country
8.4.7.1 Germany
8.4.7.2 UK
8.4.7.3 France
8.4.7.4 Netherlands
8.4.7.5 Italy
8.4.7.6 Russia
8.4.7.7 Spain
8.4.7.8 Rest of Western Europe
8.5. Asia Pacific Next Generation Memory Market
8.5.1 Key Market Trends, Growth Factors and Opportunities
8.5.2 Top Key Companies
8.5.3 Historic and Forecasted Market Size by Segments
8.5.4 Historic and Forecasted Market Size By Technology
8.5.4.1 Non-Volatile Memory
8.5.4.2 Volatile Memory
8.5.5 Historic and Forecasted Market Size By Wafer Size
8.5.5.1 200 mm
8.5.5.2 300 mm
8.5.6 Historic and Forecasted Market Size By Application
8.5.6.1 BFSI
8.5.6.2 Consumer Electronics
8.5.6.3 Government
8.5.6.4 Telecommunications
8.5.6.5 Information Technology
8.5.7 Historic and Forecast Market Size by Country
8.5.7.1 China
8.5.7.2 India
8.5.7.3 Japan
8.5.7.4 South Korea
8.5.7.5 Malaysia
8.5.7.6 Thailand
8.5.7.7 Vietnam
8.5.7.8 The Philippines
8.5.7.9 Australia
8.5.7.10 New Zealand
8.5.7.11 Rest of APAC
8.6. Middle East & Africa Next Generation Memory Market
8.6.1 Key Market Trends, Growth Factors and Opportunities
8.6.2 Top Key Companies
8.6.3 Historic and Forecasted Market Size by Segments
8.6.4 Historic and Forecasted Market Size By Technology
8.6.4.1 Non-Volatile Memory
8.6.4.2 Volatile Memory
8.6.5 Historic and Forecasted Market Size By Wafer Size
8.6.5.1 200 mm
8.6.5.2 300 mm
8.6.6 Historic and Forecasted Market Size By Application
8.6.6.1 BFSI
8.6.6.2 Consumer Electronics
8.6.6.3 Government
8.6.6.4 Telecommunications
8.6.6.5 Information Technology
8.6.7 Historic and Forecast Market Size by Country
8.6.7.1 Turkey
8.6.7.2 Bahrain
8.6.7.3 Kuwait
8.6.7.4 Saudi Arabia
8.6.7.5 Qatar
8.6.7.6 UAE
8.6.7.7 Israel
8.6.7.8 South Africa
8.7. South America Next Generation Memory Market
8.7.1 Key Market Trends, Growth Factors and Opportunities
8.7.2 Top Key Companies
8.7.3 Historic and Forecasted Market Size by Segments
8.7.4 Historic and Forecasted Market Size By Technology
8.7.4.1 Non-Volatile Memory
8.7.4.2 Volatile Memory
8.7.5 Historic and Forecasted Market Size By Wafer Size
8.7.5.1 200 mm
8.7.5.2 300 mm
8.7.6 Historic and Forecasted Market Size By Application
8.7.6.1 BFSI
8.7.6.2 Consumer Electronics
8.7.6.3 Government
8.7.6.4 Telecommunications
8.7.6.5 Information Technology
8.7.7 Historic and Forecast Market Size by Country
8.7.7.1 Brazil
8.7.7.2 Argentina
8.7.7.3 Rest of SA
Chapter 9 Analyst Viewpoint and Conclusion
9.1 Recommendations and Concluding Analysis
9.2 Potential Market Strategies
Chapter 10 Research Methodology
10.1 Research Process
10.2 Primary Research
10.3 Secondary Research