
Electronic Packaging Market Global Industry Analysis and Forecast (2024-2032) By Material (Plastic, Metal, Glass), Technology (Surface Mount Technology, Through-Hole Technology, Chip-On-Board, Flip Chip), End-User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Healthcare), And Region
Electronic Packaging Market Size Was Valued at USD 2980.56 Million in 2023 and is Projected to Reach USD 15611.26 Million by 2032, Growing at a CAGR of 20.2% From 2024-2032.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices to complete systems.
Top Active Players Involved Are:
“ASE Group (Taiwan), Amkor Technology (USA), Samsung Electronics (South Korea), Intel Corporation (USA), Texas Instruments (USA), Qualcomm Technologies (USA), Broadcom Inc. (USA), IBM Corporation (USA), STMicroelectronics (Switzerland), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Toshiba Corporation (Japan), Sony Corporation (Japan), TSMC (Taiwan), Micron Technology (USA), Analog Devices (USA), ON Semiconductor (USA), Cypress Semiconductor (USA), Fujitsu Limited (Japan), Hitachi High-Tech (Japan), TE Connectivity (Switzerland), Lam Research Corporation (USA), Applied Materials, Inc. (USA), KLA Corporation (USA) and Other Active Players.”
Electronic Packaging Market Segmented on the basis of Material, Technology, End-User.
Source: Company Database
Global Electronic Packaging Market |
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Base Year: |
2023 |
Forecast Period: |
2024-2032 |
Historical Data: |
2017 to 2023 |
Market Size in 2023: |
USD 2980.56 Mn. |
Forecast Period 2024-32 CAGR: |
20.2 % |
Market Size in 2032: |
USD 15611.26 Mn. |
Segments Covered: |
By Material |
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By Technology |
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By End-User |
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By Region |
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Global Electronic Packaging Market |
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Base Year: |
2023 |
Forecast Period: |
2024-2032 |
Historical Data: |
2017 to 2023 |
Market Size in 2023: |
USD 2980.56 Mn. |
Forecast Period 2024-32 CAGR: |
20.2 % |
Market Size in 2032: |
USD 15611.26 Mn. |
Segments Covered: |
By Material |
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By Technology |
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By End-User |
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By Region |
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Key Market Drivers: |
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Key Market Restraints: |
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Key Opportunities: |
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Companies Covered in the report: |
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The forecast period in the Electronic Packaging Market research report is 2024-2032.
ASE Group (Taiwan), Amkor Technology (USA), Samsung Electronics (South Korea), Intel Corporation (USA), Texas Instruments (USA), Qualcomm Technologies (USA), Broadcom Inc. (USA), IBM Corporation (USA), STMicroelectronics (Switzerland), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Toshiba Corporation (Japan), Sony Corporation (Japan), TSMC (Taiwan), Micron Technology (USA), Analog Devices (USA), ON Semiconductor (USA), Cypress Semiconductor (USA), Fujitsu Limited (Japan), Hitachi High-Tech (Japan), TE Connectivity (Switzerland), Lam Research Corporation (USA), Applied Materials, Inc. (USA), KLA Corporation (USA) and Other Active Players.
The Electronic Packaging Market is segmented into Material, Technology, End-User, Segment4, Segment5, Segment6, and region. By Material, the market is categorized into Plastic, Metal, and Glass. By Technology, the market is categorized into Surface Mount Technology, Through-Hole Technology, Chip-On-Board, and Flip Chip. By End-User, the market is categorized into Consumer electronics, Aerospace & Defense, Automotive, Telecommunication, and Healthcare. By region, it is analyzed across North America (U.S.; Canada; Mexico), Eastern Europe (Bulgaria; The Czech Republic; Hungary; Poland; Romania; and the Rest of Eastern Europe), Western Europe (Germany; UK; France; Netherlands; Italy; Russia; Spain; Rest of Western Europe), Asia-Pacific (China; India; Japan; Southeast Asia, etc.), South America (Brazil; Argentina, etc.), Middle East & Africa (Saudi Arabia; South Africa, etc.).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices to complete systems.
Electronic Packaging Market Size Was Valued at USD 2980.56 Million in 2023 and is Projected to Reach USD 15611.26 Million by 2032, Growing at a CAGR of 20.2% From 2024-2032