
Electronic Packaging Market Size Was Valued at USD 2980.56 Million in 2023 and is Projected to Reach USD 15611.26 Million by 2032, Growing at a CAGR of 20.2% From 2024-2032.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices to complete systems. Packaging of an electronic system is considered as a protection from mechanical damage electronic packaging is widely used in consumer electronics like smartphones, tablets, laptops, TVs, and gaming consoles to safeguard fragile internal parts and guarantee their correct operation.
It is used in the automotive industry which contains different electronic components such as engine control units, infotainment systems, sensors, and navigation systems. It offers safety from vibrations, changes in temperature, and other severe conditions. It is widely utilized in the aerospace and defense sectors to safeguard vital electronic systems in aircraft, satellites, missiles, radars, and communication devices. It helps to ensure reliable and if any interrupted performance. It helps to maintain sterility and protect against moisture and contaminants for medical devices like pacemakers, insulin pumps, diagnostic tools, and implantable devices that need electronic packaging to ensure safe and dependable functioning. electronic packaging is essential for protecting industrial machinery and equipment, control systems, robotics, and factory automation systems from dust, vibrations, electrical interference, and temperature variations.
“ASE Group (Taiwan), Amkor Technology (USA), Samsung Electronics (South Korea), Intel Corporation (USA), Texas Instruments (USA), Qualcomm Technologies (USA), Broadcom Inc. (USA), IBM Corporation (USA), STMicroelectronics (Switzerland), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Toshiba Corporation (Japan), Sony Corporation (Japan), TSMC (Taiwan), Micron Technology (USA), Analog Devices (USA), ON Semiconductor (USA), Cypress Semiconductor (USA), Fujitsu Limited (Japan), Hitachi High-Tech (Japan), TE Connectivity (Switzerland), Lam Research Corporation (USA), Applied Materials, Inc. (USA), KLA Corporation (USA) and Other Active Players.”
Electronic Packaging Market Segmented on the basis of Material, Technology, End-User.
Source: Company Database
By End-User, Consumer Electronics Segment Held the Largest Share In 2023
Electronic Packaging Market Regional Insights:
Asia Pacific is Expected to Dominate the Market Over the Forecast Period
Electronic Packaging Market |
|||
Base Year: |
2023 |
Forecast Period: |
2024-2032 |
Historical Data: |
2017 to 2023 |
Market Size in 2023: |
USD 2980.56 Mn. |
Forecast Period 2024-32 CAGR: |
20.2 % |
Market Size in 2032: |
USD 15611.26 Mn. |
Segments Covered: |
By Material |
|
|
By Technology |
|
||
By End-User |
|
||
By Region |
|
||
Key Market Drivers: |
|
||
Key Market Restraints: |
|
||
Key Opportunities: |
|
||
Companies Covered in the report: |
|
Chapter 1: Introduction
1.1 Scope and Coverage
Chapter 2:Executive Summary
Chapter 3: Market Landscape
3.1 Market Dynamics
3.1.1 Drivers
3.1.2 Restraints
3.1.3 Opportunities
3.1.4 Challenges
3.2 Market Trend Analysis
3.3 PESTLE Analysis
3.4 Porter's Five Forces Analysis
3.5 Industry Value Chain Analysis
3.6 Ecosystem
3.7 Regulatory Landscape
3.8 Price Trend Analysis
3.9 Patent Analysis
3.10 Technology Evolution
3.11 Investment Pockets
3.12 Import-Export Analysis
Chapter 4: Electronic Packaging Market by By Material
4.1 Electronic Packaging Market Snapshot and Growth Engine
4.2 Electronic Packaging Market Overview
4.3 Plastic
4.3.1 Introduction and Market Overview
4.3.2 Historic and Forecasted Market Size in Value USD
The forecast period in the Electronic Packaging Market research report is 2024-2032.
ASE Group (Taiwan), Amkor Technology (USA), Samsung Electronics (South Korea), Intel Corporation (USA), Texas Instruments (USA), Qualcomm Technologies (USA), Broadcom Inc. (USA), IBM Corporation (USA), STMicroelectronics (Switzerland), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Toshiba Corporation (Japan), Sony Corporation (Japan), TSMC (Taiwan), Micron Technology (USA), Analog Devices (USA), ON Semiconductor (USA), Cypress Semiconductor (USA), Fujitsu Limited (Japan), Hitachi High-Tech (Japan), TE Connectivity (Switzerland), Lam Research Corporation (USA), Applied Materials, Inc. (USA), KLA Corporation (USA) and Other Active Players.
The Electronic Packaging Market is segmented into Material, Technology, End-User, Segment4, Segment5, Segment6, and region. By Material, the market is categorized into Plastic, Metal, and Glass. By Technology, the market is categorized into Surface Mount Technology, Through-Hole Technology, Chip-On-Board, and Flip Chip. By End-User, the market is categorized into Consumer electronics, Aerospace & Defense, Automotive, Telecommunication, and Healthcare. By region, it is analyzed across North America (U.S.; Canada; Mexico), Eastern Europe (Bulgaria; The Czech Republic; Hungary; Poland; Romania; and the Rest of Eastern Europe), Western Europe (Germany; UK; France; Netherlands; Italy; Russia; Spain; Rest of Western Europe), Asia-Pacific (China; India; Japan; Southeast Asia, etc.), South America (Brazil; Argentina, etc.), Middle East & Africa (Saudi Arabia; South Africa, etc.).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices to complete systems.
Electronic Packaging Market Size Was Valued at USD 2980.56 Million in 2023 and is Projected to Reach USD 15611.26 Million by 2032, Growing at a CAGR of 20.2% From 2024-2032